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7-Day Countdown |Techvison invites you to the Beijing Security Expo—see you at Booth E1E29.
Publish Time：
2026-10-27 17:28
From November 3 to 6, the 18th China International Social Public Safety Products Expo (Security China 2026) will be held at the China International Exhibition Center in Beijing—Shunyi Pavilion. As one of the largest and most influential industry events in the public safety sector, each edition of Security China showcases cutting-edge technologies and emerging applications: from smart policing to low‑altitude security, and from artificial intelligence to embodied intelligence, the transformative trends reshaping the industry can all be found here.
The Techvision booth is located at E1 Artificial Intelligence/Embodied Intelligence Pavilion, Booth No. E1E29
This time, we’ve brought “edge‑side computing power” to the public‑safety frontline. Large‑scale models are moving from the cloud to edge devices: cameras, gateways, and industry‑specific terminals are beginning to “think” on their own; network outages no longer disrupt operations, and sensitive data never leaves the device. Along this trajectory,Techvison has built a comprehensive product portfolio—spanning core boards and computing modules all the way to complete systems and industry‑specific terminals. At that time, you’ll see:
Edge AI on the Device Side — From the core board and computing module to the complete system, it supports on-device inference for large models, operates offline, and keeps data within the device.
Industry Smart Terminals — Complete device form factors for field deployment, such as 5G tablets, edge gateways, and cloud terminals;
Information Technology Innovation Product Line — Domestic laptops, terminals, and motherboards based on the Phytium and Zhaoxin platforms, supporting domestic operating systems such as Kylin and UOS.
Beyond just watching, the event features a live demonstration zone where you can witness firsthand the entire process of a large-scale model performing local inference on edge devices—no internet connection, no reliance on the cloud; the computing power is built right into the device.
If you’re evaluating edge‑computing solutions for your security‑monitoring project, or if you’re interested in deploying large models on the device side, we’d be delighted to discuss your specific use cases.Techvison’s engineers will be on hand at our booth throughout the event, providing a hands‑on walkthrough—from the hardware platform to system deployment.
Meet at E1E29
The E1 Artificial Intelligence/Embodied Intelligence Pavilion brings together the AI and embodied intelligence innovations drawing the most attention at this year’s ISC. After watching the robot demonstrations next door, feel free to stop by E1E29 for a chat about the kind of computing infrastructure needed to power intelligent devices.
Exhibition Information
Exhibition Dates: November 3–6, 2026
Exhibition Venue: Beijing China International Exhibition Center (Shunyi Hall)
Huiwei Intelligent Booth: Hall E1, Booth E1E29
Registration method: Scan the QR code below to register for the visit.
AboutTechvison
As a national-level “Little Giant” enterprise specializing in niche, specialized, and innovative fields, and a listed company on the Beijing Stock Exchange (stock code 920876), Shenzhen Techvision Intelligent Technology Co., Ltd. has long been dedicated to AIoT‑based embedded system solutions, offering global customers end-to-end smart terminal ODM services that span from R&D and design through to production and manufacturing.
The company has built a product portfolio centered on mainstream platforms such as Rockchip, MTK, Unisoc, Phytium, Hygon, and Zhaoxin, with technological offerings spanning core boards, embedded motherboards, and complete systems. It continues to invest in the R&D and delivery of domestically developed information‑technology‑innovation (ITI) terminal products.
For more product details or technical documentation, please visit theTechvison official website at www.techvision.com.cn or contact our sales and technical support team.
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