MDM System
- Main parameters
- Application Manual
- Doc Download
-
Pain Points of Traditional Enterprise Management Modes

Solution of Techvision MDM System

Four-Layer Architecture to Solve Equipment Management Difficulties
After fully understanding the current problems and actual customer needs, our company independently designed the software technical architecture of the intelligent equipment management suite.The architecture is elaborated in four layers, from bottom to top: Device Perception Layer, Network Layer, Platform Layer, and Application Layer. In addition, there are Permission Management and System Log Monitoring that run through the four layers.Each layer is interconnected and complementary. However, each layer internally exists in the form of modular components and only exposes unified interfaces to the outside, thus achieving relative independence without mutual influence or dependence.
Application

Related Products
The TVD3376R is an AI edge computer based on the Rockchip RK3588 and RK1828. It uses the RK3588 as its main processor and leverages the RK1828 to deliver additional AI inference acceleration. The RK1828 delivers 20 TOPS@INT8 of AI compute performance and integrates 5 GB of high-bandwidth DRAM, making it well-suited for large models, machine vision, and a wide range of edge‑AI inference workloads. The system also offers a rich array of display, video input, networking, storage, and expansion interfaces, ideal for edge AI, machine vision, smart terminals, and other applications.
The TVI3520R is a high-performance, multi‑interface motherboard designed around the Rockchip RK3572 octa‑core processor. It integrates a CPU, GPU, and NPU, and offers a wide range of interfaces for display, video input, networking, USB, audio, and industrial communications. It is suitable for applications in edge computing, AIoT, industrial control, smart displays, machine vision, and multimedia terminals.
The TVI1710R is a high-performance M.2 2280 AI accelerator card designed around the Rockchip RK1828 AI coprocessor. It integrates a triple‑core 64‑bit RISC‑V processor, an NPU delivering 20 TOPS@INT8 computing power, and 5 GB of high‑bandwidth DRAM. Supporting multiple integer and floating‑point precision formats, it enables on‑device AI inference acceleration and is well suited for large‑model deployment, machine vision, and a wide range of AIoT applications.
Equipped with high-performance Intel® Core™ Ultra 5/Ultra 7 processors, it features a rich array of I/O interfaces and expandable storage. This product is widely applicable across industries such as smart office solutions, design and creative work, and intelligent education.
Dedicated to providing intelligent terminal product solutions for global clients
With years of accumulated experience,?Techvision continuously improves its R&D and design capabilities,
capable of independently completing product structural design and hardware design,
and possessing comprehensive solution capabilities including system design, software development, and testing certification
meeting customer needs for multi-variety, multi-batch, high-quality product manufacturing services and customized production services.